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3M ? Card Connector microSD ?
Normal Polarization, Push-Push, Surfacemount
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2900 Series
1.85 mm low profile height
Small size of 14.0 mm × 14.2 mm footprint
Smooth push–push eject mechanism
Card is retained when mated
Card polarization
Will accept a card thickness of 0.8 mm
Mechanism prevents card from flying out upon
ejection
Card detection indicator
Metal–shielded cover
microSD? specification compliant
RoHS* compliant
TS-2197-02
Physical
Date Modified: October 31, 2006
Insulation Material: High Temperature Thermoplastic
Sheet 1 of 3
Flammability:
Color:
Contact Material :
Plating
Underplating:
Wiping Area:
Termination Area:
Cover Material :
Underplating:
Solder Area:
Lock Pin and Link Pin Material:
Spring Material:
Plating:
Marking:
UL 94V-0
Black
Copper Alloy
50 μ″ [ 1.27 μ m ] min. Nickel
15 μ″ [ 0.38 μ m ] min. Gold
3 μ″ [ 0.076 μ m ] max. Gold flash
Stainless Steel
40 μ″ [ 1.02 μ m ] min. Nickel
Gold flash
Stainless Steel
Copper Alloy
30 μ″ [ 0.762 μ m ] min. Nickel
3M Logo
Electrical
Current Rating : 0.5 A
Insulation Resistance: 100 ΜΩ min.
Withstanding Voltage: 500 VAC for one minute
Environmental
Operating Temperature: -25 ° C to +85 ° C
Storage Temperature: -40 ° C to +85 ° C
Process Rating: Maximum 250 ° C, with 40 seconds over 230 ° C
*"RoHS compliant" means that the product or part does not contain any of the following substances in excess of the following maximum concentration values
in any homogeneous material, unless the substance is in an application that is exempt under RoHS: (a) 0.1% (by weight) for lead, mercury, hexavalent
chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. Unless otherwise stated by 3M in writing,
this information represents 3M's knowledge and belief based upon information provided by third party suppliers to 3M.
microSD is a trademark of SD Association in Japan.
3
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
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